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Fiber Optics
V23839-R3x-L55 iSFF - Intelligent Small Form Factor 1.25 Gigabit Ethernet (1000 Base-SX) 4.25/2.125/1.0625 Gbit/s Fibre Channel (400/200/100-M5/M6-SN-I) Multimode 850 nm Transceiver with LCTM Connector
Preliminary Data Sheet Features * Based on Small Form Factor (SFF) MSA1) * Fully SFF-8472 compatible * Incorporating Intelligent - Digital Diagnostic Monitoring Interface * Internal calibration implementation * Excellent EMI performance * Separate and common chassis/signal ground module concepts available * 2x7 footprint * RJ-45 style LCTM connector system * Single power supply (3.3 V) * Extremely low power consumption of 530 mW typical * Small size for high port density * UL-94 V-0 certified * ESD Class 1C per JESD22-A114-B (MIL-STD 883D Method 3015.7) * According to FCC (Class B) and EN 55022 * For distances of up to 860 m (50 m fiber) * Laser safety according to Class 1 FDA and IEC * Internally AC/AC coupled * Operating temperature range of -20C to 85C * iSFF evaluation kit available upon request
File: 1145
1)
MSA documentation can be found at www.infineon.com/fiberoptics under Transceivers, SFF Transceivers.
LCTM is a trademark of Lucent.
Part Number V23839-R35-L55 V23839-R36-L55
Preliminary Product Information
Chassis/Signal Grounding Concept Common Separated
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Pin Configuration Pin Configuration
Tx
MS
HL D B 10 9 8 7 6 HL
TOP VIEW Rx
CA12 3 4 5 MS HL
File: 1344
HL
Figure 1
iSFF Transceiver Electrical Pin Layout
Preliminary Product Information
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Pin Configuration Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 A B C D MS HL
1)
Name
Logic Level N/A N/A LVTTL LVPECL LVPECL N/A N/A LVTTL LVPECL LVPECL LVTTL LVTTL LVTTL LVTTL N/A N/A
Function Receiver Ground Receiver Power Signal Detect1) 5) Inv. Received Data Out2) Received Data Out2) Transmitter Power Transmitter Ground Transmitter Disable3) Transmit Data In4) Inv. Transmit Data In4) 2-wire Data Interface5) 2-wire Clock Interface5) 1 & 2 or 2 & 4 Gbit/s7) Transmitter Fault5) Mounting Studs8) Housing Leads9)
VEER VCCR
SD RD- RD+
VCCT VEET
TxDis TD+ TD- SDA SCL Rate Select6) Tx Fault MS HL
2) 3) 4) 5) 6) 7) 8)
9)
Normal operation: Logic 1 output, represents that light is present at receiver input. Fault condition: Logic 0 output. AC coupled inside transceiver. Must be terminated with 100 differential at the user SERDES. A logic 0 switches the transmitter on. A logic 1 switches the transmitter off. AC coupled and 100 differential termination inside the transceiver. Should be pulled up on host board to VCC by 4.7 - 10 k. Not implemented. In accordance to SFF Committee SFF-8079 Draft. Mounting Studs are provided for transceiver mechanical attachment to the circuit board. They also provide an optional connection of the transceiver to the equipment chassis ground. The transceiver Housing Leads are provided for additional signal grounding. The holes in the circuit board must be included and be tied to signal ground (see EMI Recommendations).
Preliminary Product Information
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Description Description The Infineon Fibre Channel multimode transceiver - part of Infineon iSFF family - is compatible to the Physical Medium Depend (PMD) sublayer and baseband medium, type 1000 Base-SX (short wavelength) as specified in IEEE Std 802.3 and Fibre Channel FC-PI-2 (Rev. 5.0) 400-M5-SN-I, 400-M6-SN-I for 4.25 Gbit/s, FC-PI-2 (Rev. 5.0) 200-M5-SN-I, 200-M6-SN-I for 2.125 Gbit/s, and FC-PI-2 (Rev. 5.0) 100-M5-SN-I, 100-M6-SN-I for 1.0625 Gbit/s. The appropriate fiber optic cable is 62.5 m or 50 m multimode fiber with LCTM connector.
Preliminary Product Information
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Description Link Length as Defined by IEEE and Fibre Channel Standards Fiber Type min.1) at 1.0625 Gbit/s 50 m, 2000 MHz*km 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km at 1.25 Gbit/s 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km at 2.125 Gbit/s 50 m, 2000 MHz*km 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km at 4.25 Gbit/s 50 m, 2000 MHz*km 50 m, 500 MHz*km 50 m, 400 MHz*km 62.5 m, 200 MHz*km 62.5 m, 160 MHz*km
1)
Reach max.2) 860 500 450 300 250 550 500 275 220 500 300 260 150 120 270 150 130 70 55
Unit
0.5 0.5 0.5 0.5 0.5 2 2 2 2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
meters
meters
meters
meters
2)
Minimum reach as defined by IEEE and Fibre Channel Standards. A 0 m link length (loop-back connector) is supported. Maximum reach as defined by IEEE and Fibre Channel Standards. Longer reach possible depending upon link implementation.
Preliminary Product Information
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Description The Infineon iSFF multimode transceiver is a single unit comprised of a transmitter, a receiver, and an LCTM receptacle. This transceiver supports the LCTM connectorization concept. It is compatible with RJ-45 style backpanels for high end datacom and telecom applications while providing the advantages of fiber optic technology. The module is designed for low cost SAN, LAN, Fibre Channel and Gigabit Ethernet applications. It can be used as the network end device interface in mainframes, workstations, servers, and storage devices, and in a broad range of network devices such as bridges, routers, hubs, and local and wide area switches. This transceiver operates at 1.0625 Gbit/s / 1.25 Gbit/s / 2.125 Gbit/s / 4.25 Gbit/s from a single power supply (+3.3 V). The 100 differential data inputs and outputs are CML compatible. Functional Description of iSFF Transceiver This transceiver is designed to transmit serial data via multimode cable.
Tx Fault Automatic Shut-Down Tx Disable Tx Coupling Unit TD+ TD- Laser Driver e/o Laser
Power Control Monitor SD RD+ RD- Limiting Amp TIA
o/e Multimode Fiber Rx Coupling Unit o/e
Rate Select 1) MOD-DEF(2) MOD-DEF(1) Digital Diagnostic Monitoring Interface EEPROM
1) Not
implemented
Alarm and Warning Flags
File: 1368
Figure 2
Functional Diagram
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Preliminary Product Information
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Description The receiver component converts the optical serial data into CML compatible electrical data (RD+ and RD-). The Signal Detect (SD) shows whether an optical signal is present. The transmitter converts CML compatible electrical serial data (TD+ and TD-) into optical serial data. Data lines are differentially 100 terminated. The transmitter contains a laser driver circuit that drives the modulation and bias current of the laser diode. The currents are controlled by a power control circuit to guarantee constant output power of the laser over temperature and aging. The power control uses the output of the monitor PIN diode (mechanically built into the laser coupling unit) as a controlling signal, to prevent the laser power from exceeding the operating limits. Single fault condition is ensured by means of an integrated automatic shutdown circuit that disables the laser when it detects laser fault to guarantee the laser Eye Safety. The transceiver contains a supervisory circuit to control the power supply. This circuit makes an internal reset signal whenever the supply voltage drops below the reset threshold. It keeps the reset signal active for at least 140 milliseconds after the voltage has risen above the reset threshold. During this time the laser is inactive. A low signal on TxDis enables transmitter. If TxDis is high or not connected the transmitter is disabled. An enhanced Digital Diagnostic Monitoring Interface (Intelligent) has been incorporated into the Infineon SFF transceiver. This allows real time access to transceiver operating parameters, based on the SFF-8472. This transceiver features Internal Calibration. Measurements are calibrated over operating temperature and voltage and must be interpreted as defined in SFF-8472. The transceiver generates this diagnostic data by digitization of internal analog signals monitored by a new diagnostic Integrated Circuit (IC). This diagnostic IC has inbuilt sensors to include alarm and warning thresholds. These threshold values are set during device manufacture and therefore allow the user to determine when a particular value is outside of its operating range. Alarm and Warning Flags are given. Alarm Flags indicate conditions likely to be associated with an inoperational link and cause for immediate action. Warning Flags indicate conditions outside the normally guaranteed bounds but not necessarily causes of immediate link failures. These enhanced features are in addition to the existing SFF features provided by the manufacturer i.e. serial number and other vendor specific data. The serial ID interface defines a 256 byte memory map in EEPROM, accessible over a 2 wire, serial interface at the 8 bit address 1010000X (A0h). The Digital Diagnostic Monitoring Interface makes use of the 8 bit address 1010001X (A2h), so the originally defined serial ID memory map remains unchanged and is therefore backward compatible.
Preliminary Product Information
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Description Digital Diagnostic Monitoring Parameters Parameter Tx Optical Power Rx Optical Power Bias Current Power Supply Voltage Transceiver Temperature Accuracy SFF-8472 3 dB 3 dB 10% 3% 3C Accuracy Actual 3 dB 3 dB 10% 3% 3C
Regulatory Compliance (EMI) Feature ESD: Electrostatic Discharge to the Electrical Pins Immunity: Against Electrostatic Discharge (ESD) to the Duplex LC Receptacle Immunity: Against Radio Frequency Electromagnetic Field Standard EIA/JESD22-A114-B (MIL-STD 883D method 3015.7) EN 61000-4-2 IEC 61000-4-2 Comments Class 1C
Discharges ranging from 2 kV to 15 kV on the receptacle cause no damage to transceiver (under recommended conditions). With a field strength of 10 V/m, noise frequency ranges from 10 MHz to 2 GHz. No effect on transceiver performance between the specification limits. Noise frequency range: 30 MHz to 18 GHz
EN 61000-4-3 IEC 61000-4-3
Emission: FCC 47 CFR Part 15, Radiated Field Strength Class B CISPR 22 EN 55022 Class B
Preliminary Product Information
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Description
(13.97) *) .550
*) min. pitch between SFF transceiver according to MSA.
Dimensions in (mm) inches
File: 1501
Figure 3
Transceiver Pitch
Preliminary Product Information
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Technical Data Technical Data Absolute Maximum Ratings Parameter Data Input Voltage Differential Data Input Voltage Swing Storage Ambient Temperature Operating Case Temperature Storage Relative Humidity Operating Relative Humidity Supply Voltage Data Output Current Receiver Optical Input Power Hand Lead Soldering Temp/Time Wave Soldering Temp/Time Aqueous Wash Pressure Symbol Limit Values min. max. Unit V V C C % % V mA dBm C/s C/s psi
VID max VIDpk-pk TS TC
RHs RHo
VCC+0.5
5 -40 -20 5 5 85 85 95 85 4 50 3 260/10 260/10 < 110
VCC max Idata
RxP max
Exceeding any one of these values may permanently destroy the device.
Preliminary Product Information
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Technical Data Electrical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) Parameter Common Supply Voltage In-rush Current1) Power Dissipation Transmitter Differential Data Input Voltage Swing2) Tx Disable Voltage Tx Enable Voltage Tx Fault High Voltage Tx Fault Low Voltage Supply Current3) Receiver Differential Data Output Voltage VODpk-pk 500 Swing 4) Signal Detect High Signal Detect Low Rate Select 1 / 2 Gbit/s
5) 6)
Symbol min.
Values typ. 3.3 max. 3.63 30 400 500 2 900 3200
Unit
VCC-VEE IIR max P VIDpk-pk
TxDis TxEn TxFH TxFL
2.97
V mA mW mV V V V V mA mV V V V V ps ps ps mVpp mA
VCC
0.8
VEE
2.4
VCC
0.5 100 150 1000
VEE
ITx
SDH SDL RSLOW RSHIGH DJ-CRx TJ-CRx JRx
2.4
VCC
0.5
VEE
2
VCC
0.8 23.5 61.8 45 100 80 90
Rate Select 2 / 4 Gbit/s5) 6) Contributed Deterministic Jitter Contributed Total Jitter Jitter (pk-pk)7) Supply Current 3)
1)
VEE
Power Supply Noise Rejection8) PSNR
9)
IRx
2) 3) 4)
5) 6) 7)
Measured with MSA recommended supply filter network (Figure 8). Maximum value above that of the steady state value. Internally AC coupled. Typical 100 differential input impedance. MSA defines maximum current at 300 mA. Internally AC coupled. Load 50 to GND or 100 differential. For dynamic measurement a tolerance of 50 mV should be added. In accordance to SFF Committee SFF-8079 Draft. Not implemented. Jitter (pk-pk) is measured using a 27-1 NRZ PRBS and a Digital Communications Analyzer.
Preliminary Product Information
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Technical Data
8)
9)
Measured using a 20 Hz to 1 MHz sinusoidal modulation with the MSA recommended power supply filter network (Figure 8) in place. A change in sensitivity of less than 1 dB can be typically expected. Supply current excluding Rx output load.
Preliminary Product Information
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Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) Parameter Transmitter Optical Modulation Amplitude 1) @ 4.25 Gbit/s @ 2.125 Gbit/s @ 1.0625 Gbit/s Launched Power (Average)2) Extinction Ratio (Dynamic)3) Center Wavelength Spectral Width (rms) Relative Intensity Noise Contributed Deterministic Jitter Contributed Total Jitter Jitter (pk-pk)4) Rise Time5) Fall Time
5) 6)
Symbol min. OMA 247 196 156
Values typ. max.
Unit
W
PO
ER C I RIN DJ-CTx TJ-CTx JTx
-8.5 9 830 850
-4 860 0.85 -118 28.2 59.8 45 90 90
dBm dB nm nm dB/Hz ps ps ps ps ps W
tR-Tx tF-Tx
OMA
Receiver
Min. Optical Modulation Amplitude 7) @ 4.25 Gbit/s @ 2.125 Gbit/s @ 1.0625 Gbit/s Average Received Power Sensitivity (Average Power)8) @ 1.25 Gbit/s Stressed Receiver Sensitivity 50 m Fiber9) @ 4.25 Gbit/s @ 2.125 Gbit/s @ 1.0625 Gbit/s @ 1.25 Gbit/s10)
61 49 31
PR PIN SPIN
50 m
0 -19
dBm dBm
138 96 55 -13.5
W W W dBm
Preliminary Product Information
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Technical Data Optical Characteristics (VCC = 2.97 V to 3.63 V, TC = -20C to 85C) (cont'd) Parameter Stressed Receiver Sensitivity 62.5 m Fiber9) @ 4.25 Gbit/s @ 2.125 Gbit/s @ 1.0625 Gbit/s @ 1.25 Gbit/s10) SD Assert Level 11) SD Deassert Level 11) SD Hysteresis11) Input Center Wavelength Optical Return Loss
1)
Symbol min.
Values typ. max.
Unit
SPIN
62.5 m 148 109 67 -12.5 W W W dBm dBm dBm dB 850 860 nm dB
PSDA PSDD PSDA
-PSDD C ORL
-23 -30 1 770 12
2) 3) 4) 5) 6) 7) 8) 9)
10) 11)
Fibre Channel PI Standard. Typical OMA values based on -6 dBm launched power (average) and 15 dB extinction ratio. Into multimode fiber, 62.5 m or 50 m diameter. For GbE applications only. Jitter (pk-pk) is measured using a 27-1 NRZ PRBS and a Digital Communications Analyzer. Measured at nominal data rate. These are unfiltered 20% - 80% values. Receiver characteristics are measured with a worst case reference laser. Fibre Channel PI Standard. Average optical power at which the BER is 1x10-12. Measured with a 27-1 NRZ PRBS and ER = 9 dB. Measured at the given Stressed Receiver Eye Closure Penalty and DCD component given in Fibre Channel PI Standard (2.03/2.18 dB & 40/80 ps). Measured with a transmit signal having a 9 dB extinction ratio. See Figure 4.
Preliminary Product Information
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Technical Data
1 SD Level 0 SD Assert (Minimum) Hysteresis (Minimum) SD Deassert (Maximum)
SD deassertion range
SD persistence
SD assertion range
SD / Hysteresis (Typical)
Received Optical Power Level [dBm]
File: 1523
Figure 4
Preliminary Product Information
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Technical Data Timing of Control and Status I/O Parameter Tx Disable Assert Time Symbol t_off Values min. max. 10 s Time from rising edge of Tx Disable to when the optical output falls below 10% of nominal Time from falling edge of Tx Disable to when the modulated optical output rises above 90% of nominal From power on or negation of Tx Fault using Tx Disable Time from fault to Tx Fault on Time Tx Disable must be held high to reset Tx Fault Time from SD state to Rx SD assert Time from non-SD state to Rx SD deassert Unit Condition
Tx Disable Negate Time
t_on
1
ms
Time to Initialize, t_init Including Reset of Tx Fault Tx Fault Assert Time Tx Disable to Reset SD Assert Time SD Deassert Time t_fault t_reset t_SD_on t_SD_off 10
300
ms
100
s s
100 100
s s
Preliminary Product Information
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Technical Data I/O Timing of Soft Control and Status Functions Parameter Tx Disable assert time Symbol t_off Max. Value 100 Unit ms Condition Time from Tx Disable bit set1) until optical output falls below 10% of nominal Time from Tx Disable bit cleared until optical output rises above 90% of nominal Time from power on or negation of Tx Fault using Tx Disable until transmitter output is stable2) Time from fault to Tx Fault bit set Time from SD state to Rx SD bit set Time from non-SD state to Rx SD bit cleared Time from change of state of Rate Select bit1) until receiver bandwidth is in conformance with appropriate specification N/A From power on to data ready, bit 0 of byte 110 set Time from power on until module is ready for data transmission
Tx Disable deassert t_on time Time to initialize, including reset of Tx Fault t_init
100
ms
300
ms
Tx Fault assert time t_fault SD assert time SD deassert time Rate select change time3) t_SD_on t_SD_off t_rate_sel
100 100 100 100
ms ms ms ms
Serial ID clock rate4) f_serial_clock Analog parameter data ready t_data
400 1000 300
kHz ms ms
Serial bus hardware t_serial ready
1) 2) 3) 4)
Measured from falling clock edge after stop bit of write transaction. See Gigabit Interface Converter (GBIC). SFF-0053, Rev. 5.5, September 27, 2000. Not implemented. The maximum clock rate of the serial interface is defined by the I2C bus interface standard.
Preliminary Product Information
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Eye Safety Eye Safety This laser based multimode transceiver is a Class 1 product. It complies with IEC 60825-1/A2: 2001 and FDA performance standards for laser products (21 CFR 1040.10 and 1040.11) except for deviations pursuant to Laser Notice 50, dated July 26, 2001. CLASS 1 LASER PRODUCT To meet laser safety requirements the transceiver shall be operated within the Absolute Maximum Ratings. Note: All adjustments have been made at the factory prior to shipment of the devices. No maintenance or alteration to the device is required. Tampering with or modifying the performance of the device will result in voided product warranty. Failure to adhere to the above restrictions could result in a modification that is considered an act of "manufacturing", and will require, under law, recertification of the modified product with the U.S. Food and Drug Administration (ref. 21 CFR 1040.10 (i)). Laser Emission Data Wavelength Maximum total output power (as defined by IEC: 7 mm aperture at 14 mm distance) Beam divergence (full angle) / NA (half angle) 850 nm 709 W / -1.5 dBm 20 / 0.18 rad
FDA
Complies with 21 CFR 1040.10 and 1040.11
IEC
Class 1 Laser Product
File: 1401
Figure 5
Required Labels
Laser Emission
Tx Top view Rx
File: 1345
Figure 6
Laser Emission
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Preliminary Product Information
V23839-R3x-L55
Application Notes Application Notes Small Form Factor Pinning Comparison The drawing below gives you a comparison between the different pinnings 2x5, 2x7, 2x10. Dimension for diameter and distance of additional pins is similar to the existing dimensions of the other pins.
1) Not implemented VCCPIN 1 RxVEE 2 RxVEE 3 RxCLK- 4 RxCLK+ 5 RxVEE 6 RxVCC 7 SD 8 RxD- 9 RxD+ 10
Top view Rx Tx
20 19 18 17 16 15 14 13 12 11 PMON+ PMON- BIASMON+ BIASMON- TxVEE TxD- TxD+ TxDis TxVEE TxVCC
RxVEE RxVCC SD RxD- RxD+
1 2 3 4 5
Rate Select 1) SDA RxVEE RxVCC SD RxD- RxD+
C A 1 2 3 4 5
D B 10 9 8 7 6
Tx Fault SCL TxD- TxD+ TxDis TxVEE TxVCC
10 9 8 7 6
TxD- TxD+ TxDis TxVEE TxVCC
2 x 10 2x7 2x5
File: 1524
Figure 7
Preliminary Product Information
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Application Notes EMI Recommendations To avoid electromagnetic radiation exceeding the required limits set by the standards, please take note of the following recommendations. When Gigabit switching components are found on a PCB (e.g. multiplexer, serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak radiation; this may also occur at chassis slots other than that of the device itself. Thus every mechanical opening or aperture should be as small as feasible and its length carefully considered. On the board itself, every data connection should be an impedance matched line (e.g. strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed symmetrically. Vias should be avoided. Where internal termination inside an IC or a transceiver is not present, a line terminating resistor must be provided. The decision of how best to establish a ground depends on many boundary conditions. This decision may turn out to be critical for achieving lowest EMI performance. At RF frequencies the ground plane will always carry some amount of RF noise. Thus the ground and VCC planes are often major radiators inside an enclosure. As a general rule, for small systems such as PCI cards placed inside poorly shielded enclosures, the common ground scheme has often proven to be most effective in reducing RF emissions. In a common ground scheme, the PCI card becomes more equipotential with the chassis ground. As a result, the overall radiation will decrease. In a common ground scheme, it is strongly recommended to provide a proper contact between signal ground and chassis ground at every location where possible. This concept is designed to avoid hotspots which are places of highest radiation, caused when only a few connections between chassis and signal grounds exist. Compensation currents would concentrate at these connections, causing radiation. However, as signal ground may be the main cause for parasitic radiation, connecting chassis ground and signal ground at the wrong place may result in enhanced RF emissions. For example, connecting chassis ground and signal ground at a front panel/bezel/chassis by means of a fiber optic transceiver may result in a large amount of radiation especially where combined with an inadequate number of grounding points between signal ground and chassis ground. Thus the transceiver becomes a single contact point increasing radiation emissions. Even a capacitive coupling between signal ground and chassis ground may be harmful if it is too close to an opening or an aperture. For a number of systems, enforcing a strict separation of signal ground from chassis ground may be advantageous, providing the housing does not present any slots or other discontinuities. This separate ground concept seems to be more suitable in large systems where appropriate shielding measures have also been implemented. In many situations the question on which ground concept to implement in the design cannot be easily decided prior to the receipt of first EMI measurement results. Infineon thus offers both module versions; V23839-Xx5-Xxx for common ground and V23839-Xx6-Xxx for separate ground concept.
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Application Notes The return path of RF current must also be considered. Thus a split ground plane between Tx and Rx paths may result in severe EMI problems irrespective of which module ground concept has been applied. The bezel opening for a transceiver should be sized so that all contact springs of the transceiver make good electrical contact with the face plate. Please consider that the PCB may behave like a dielectric waveguide. With a dielectric constant of 4, the wavelength of the harmonics inside the PCB will be half of that in free space. Thus even the smallest PCBs may have unexpected resonances.
Preliminary Product Information
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Application Notes EEPROM Serial ID Memory Contents (A0h), V23839-R35-L55
Addr. Hex ASCII Name/Description 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 02 04 07 00 00 00 01 40 40 0C 15 01 2B 00 00 00 0F 07 00 00 49 6E 66 69 6E 65 6F 6E 20 46 4F 20 I n f i n e o n F O Identifier Extended identifier Connector Transceiver optical compatibility Addr. Hex ASCII Name/Description 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 47 6D 62 48 00 00 03 19 56 32 33 38 33 39 2D 52 33 35 2D 4C 35 35 20 20 42 31 41 39 03 52 00 21 G m b H Reserved Vendor OUI Vendor name
Encoding BR, nominal Reserved Length (9 m) - km Length (9 m) Length (50 m) Length (62.5 m) Length (copper) Reserved Vendor name
V 2 3 8 3 9 R 3 5 L 5 5
Vendor part number
B 1 A 9
Vendor revision, product status dependent
Wavelength Reserved Check sum of bytes 0 - 62
Preliminary Product Information
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Application Notes EEPROM Serial ID Memory Contents (A0h), V23839-R35-L55 (cont'd)
Addr. Hex ASCII Name/Description 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 00 1C 00 4B Transceiver signal options BR, maximum BR, minimum Vendor serial number Addr. Hex ASCII Name/Description 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 Vendor manufacturing date code 116 117 118 119 120 121 122 123 Diagnostic monitoring type Enhanced options SFF-8472 compliance Low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive 124 125 126 127 128 255 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 00 Vendor specific. Reserved for future use
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Vendor specific EEPROM
20 20 20 20 20 20 20 20
20 20 68 B0 01
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Application Notes EEPROM Serial ID Memory Contents (A0h), V23839-R36-L55
Addr. Hex ASCII Name/Description 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 02 04 07 00 00 00 01 40 40 0C 15 01 2B 00 00 00 0F 07 00 00 49 6E 66 69 6E 65 6F 6E 20 46 4F 20 I n f i n e o n F O Identifier Extended identifier Connector Transceiver optical compatibility Addr. Hex ASCII Name/Description 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 47 6D 62 48 00 00 03 19 56 32 33 38 33 39 2D 52 33 36 2D 4C 35 35 20 20 44 31 41 39 03 52 00 24 G m b H Reserved Vendor OUI Vendor name
Encoding BR, nominal Reserved Length (9 m) - km Length (9 m) Length (50 m) Length (62.5 m) Length (copper) Reserved Vendor name
V 2 3 8 3 9 R 3 6 L 5 5
Vendor part number
D 1 A 9
Vendor revision, product status dependent
Wavelength Reserved Check sum of bytes 0 - 62
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Application Notes EEPROM Serial ID Memory Contents (A0h), V23839-R36-L55 (cont'd)
Addr. Hex ASCII Name/Description 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 00 1C 00 4B Transceiver signal options BR, maximum BR, minimum Vendor serial number Addr. Hex ASCII Name/Description 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 Vendor manufacturing date code 116 117 118 119 120 121 122 123 Diagnostic monitoring type Enhanced options SFF-8472 compliance Low order 8 bits of the sum of the contents of all the bytes from byte 64 to byte 94, inclusive 124 125 126 127 128 255 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 00 Vendor specific. Reserved for future use
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Vendor specific EEPROM
20 20 20 20 20 20 20 20
20 20 68 B0 01
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Application Notes Digital Diagnostic Monitoring Interface - Intelligent Alarm and Warning Thresholds (2-Wire Address A2h) Address 00 - 01 02 - 03 04 - 05 06 - 07 08 - 09 10 - 11 12 - 13 14 - 15 16 - 17 18 - 19 20 - 21 22 - 23 24 - 25 26 - 27 28 - 29 30 - 31 32 - 33 34 - 35 36 - 37 38 - 39 40 - 55
1)
# Bytes 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 16
Name Temp High Alarm Temp Low Alarm Temp High Warning Temp Low Warning Voltage High Alarm Voltage Low Alarm Voltage High Warning Voltage Low Warning Bias High Alarm Bias Low Alarm Bias High Warning Bias Low Warning Tx Power High Alarm Tx Power Low Alarm Tx Power High Warning Tx Power Low Warning Rx Power High Alarm Rx Power Low Alarm Rx Power High Warning Rx Power Low Warning Reserved
Description MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address MSB at low address Reserved for future monitored quantities
Value 95C1) -20C1) 90C1) -15C1) 3.7 V2) 2.85 V2) 3.63 V2) 2.97 V2) 28 mA 3.1 mA 14.8 mA 4.6 mA -3.5 dBm -8.5 dBm -4 dBm -7.5 dBm -4.5 dBm -16 dBm -5 dBm -14 dBm
2)
A delta exists between actual transceiver temperature and value shown as measurement is taken internal to an IC located on the top side of the iSFF PCB. Transceiver voltage measured after input filter with typical 0.1 V voltage drop.
Preliminary Product Information
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V23839-R3x-L55
Application Notes Calibration Constants for External Calibration Option (2-Wire Address A2h) Address 56 - 59 60 - 63 64 - 67 68 - 71 72 - 75 76 - 77 78 - 79 # Bytes 4 4 4 4 4 2 2 Name Rx_PWR (4) Rx_PWR (3) Rx_PWR (2) Rx_PWR (1) Rx_PWR (0) Tx_I(Slope) Tx_I (Offset) Description Value Single precision floating point 0 calibration data, Rx optical power. 0 0 1 0 Fixed decimal (unsigned) 1 calibration data, laser bias current. Fixed decimal (signed two's complement) calibration data, laser bias current. Fixed decimal (unsigned) calibration data, transmitter coupled output power. 0
80 - 81
2
Tx_PWR (Slope)
1
82 - 83
2
Tx_PWR (Offset) Fixed decimal (signed two's 0 complement) calibration data, transmitter coupled output power. T (Slope) Fixed decimal (unsigned) calibration data, internal module temperature. Fixed decimal (signed two's complement) calibration data, internal module temperature. Fixed decimal (unsigned) calibration data, internal module supply voltage. Fixed decimal (signed two's complement) calibration data, internal module supply voltage. Reserved Byte 95 contains the low order 8 bits of the sum of bytes 0 - 94. 1
84 - 85
2
86 - 87
2
T (Offset)
0
88 - 89
2
V (Slope)
1
90 - 91
2
V (Offset)
0
92 - 94 95
3 1
Reserved Check sum
Preliminary Product Information
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V23839-R3x-L55
Application Notes A/D Values and Status Bits (2-Wire Address A2h) Byte 96 97 98 99 100 101 102 103 104 105 106 107 108 109 Bit All All All All All All All All All All All All All All Name Temperature MSB Temperature LSB VCC MSB VCC LSB Tx Bias MSB Tx Bias LSB Tx Power MSB Tx Power LSB Rx Power MSB Rx Power LSB Reserved MSB Reserved LSB Reserved MSB Reserved LSB Reserved for 1st future definition of digitized analog input Reserved for 1st future definition of digitized analog input Reserved for 2nd future definition of digitized analog input Reserved for 2nd future definition of digitized analog input Digital state of the Tx Disable Input Pin Read/write bit that allows software disable of laser. Writing 1 disables laser Digital state of the SFF Rx Rate Select Input Pin Read/write bit that allows software Rx rate select. Writing 1 selects full bandwidth operation3) Measured Rx input power Measured Tx output power Internally measured Tx Bias Current Internally measured supply voltage in transceiver Description Internally measured module temperature1) Converted Analog Values. Calibrated 16 Bit Data.
Optional Status/Control Bits 110 110 7 6 Tx Disable State2) Soft Tx Disable2)
110 110 110
5 4 3
Reserved Rx Rate Select State2) Soft Rx Rate Select2)
Preliminary Product Information
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V23839-R3x-L55
Application Notes A/D Values and Status Bits (2-Wire Address A2h) (cont'd) Byte 110 110 110 111
1) 2) 3)
Bit 2 1 0 7-0
Name Tx Fault SD Data_Ready_Bar Soft Rx Rate Select2)
Description Digital state of the Tx Fault Output Pin Digital state of the SD Output Pin Indicates transceiver has achieved power up and data is ready Rate Select3)
Temperature measurement is performed on an IC located on the top side of the iSFF PCB. Not implemented. In accordance to SFF Committee SFF-8079 Draft.
Preliminary Product Information
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V23839-R3x-L55
Application Notes Alarm and Warning Flags (2-Wire Address A2h) Byte 112 112 112 112 112 112 112 112 113 113 113 113 113 113 113 113 114 115 116 116 116 Bit 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 All All 7 6 5 Name Temp High Alarm Temp Low Alarm VCC High Alarm VCC Low Alarm Tx Bias High Alarm Tx Bias Low Alarm Tx Power High Alarm Tx Power Low Alarm Rx Power High Alarm Rx Power Low Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Alarm Reserved Reserved Temp High Warning Temp Low Warning VCC High Warning Set when internal temperature exceeds high warning level Set when internal temperature is below low warning level Set when internal supply voltage exceeds high warning level
30 2004-06-25
Description Set when internal temperature exceeds high alarm level Set when internal temperature is below low alarm level Set when internal supply voltage exceeds high alarm level Set when internal supply voltage is below low alarm level Set when Tx Bias current exceeds high alarm level Set when Tx Bias current is below low alarm level Set when Tx output power exceeds high alarm level Set when Tx output power is below low alarm level Set when received power exceeds high alarm level Set when received power is below low alarm level
Preliminary Product Information
V23839-R3x-L55
Application Notes Alarm and Warning Flags (2-Wire Address A2h) (cont'd) Byte 116 116 116 116 116 117 117 117 117 117 117 117 117 118 119 Bit 4 3 2 1 0 7 6 5 4 3 2 1 0 All All Name VCC Low Warning Tx Bias High Warning Tx Bias Low Warning Tx Power High Warning Tx Power Low Warning Rx Power High Warning Rx Power Low Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Warning Reserved Reserved Description Set when internal supply voltage is below low warning level Set when Tx bias current exceeds high warning level Set when Tx bias current is below low warning level Set when Tx output power exceeds high warning level Set when Tx output power is below low warning level Set when received power exceeds high warning level Set when received power is below low warning level
Vendor Specific Memory Addresses (2-Wire Address A2h) Address 120 -127 # Bytes 8 Name Vendor Specific Description Vendor specific
User EEPROM (2-Wire Address A2h) Address # Bytes Name User EEPROM Vendor Specific Description User writable EEPROM Vendor specific control functions 128 - 247 120 248 - 255 8
Preliminary Product Information
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V23839-R3x-L55
Application Notes Multimode 850 nm iSFF Transceiver, AC/AC TTL
Host Board
3.3 V
1 H
Infineon iSFF Transceiver
VCCT
0.1 F xx 1)
Protocol VCC Protocol VCC
10 F
0.1 F
1 H
6
4.7 to 10 k
VEET
4.7 to 10 k
7 8 D 10
0.1 F
Tx Disable Tx Fault
Tx Disable Tx Fault TD-
100
Laser Driver
TD+
9
0.1 F
VCCR
2
Protocol IC
ASIC IC
4.7 to 10 k
10 F
0.1 F
xx 1)
VEER
1
RD+
100
5
0.1 F
RD- SD SD
4 3
Pre-Amp./ Post Amp. 0.1 F
Rate Select 2) 3.3 V
Rate Select 2)
C
Diagnostic IC / EEPROM
PLD / PAL
4.7 to 10 k
4.7 to 10 k
A
SDA
B
SCL
1) Design criterion of the capacitor used is the resonant frequency and its value must be in the order of the nominal data rate. Use of single layer capacitors recommended. Short trace lengths are mandatory. 2) Not implemented. File: 1321
Figure 8
Example iSFF Host Board Schematic and Recommended Host Board Supply Filtering Network
Preliminary Product Information
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V23839-R3x-L55
Package Outlines Package Outlines
Dimensions in mm
File: 1228
Figure 9
Preliminary Product Information
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2004-06-25
V23839-R3x-L55 Revision History: Previous Version: Page 4 2004-06-25 2004-02-13 DS2
Subjects (major changes since last revision) Description changed
11, 13, 22, Tables changed 26, 28 18 32 33 Eye Safety changed Table Laser Emission Data changed Figure 8 Host Board Schematic changed Package Outlines changed
Edition 2004-06-25 Published by Infineon Technologies AG, St.-Martin-Strasse 53, 81669 Munchen, Germany
(c) Infineon Technologies AG 2004.
All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

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